FabNotes.html

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      <h4> Fabrication Notes </h4>
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      <li> TOTAL THICKNESS: NOM 0.062" </li>
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          <li> USE STANDARD FR4 FOR ALL CORE DIELECTRICS </li>
          <li> USE ISOLA 370HR FOR PREPREG DIELECTRICS </li>
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      <li> USE 1oz COPPER ON ALL LAYERS </li>
      <li> APPLY SOLDER MASK OVER BARE COPPER ON BOTH SIDES. SOLDERMASK SHALL BE GREEN IN COLOR </li>
      <li> EXPOSED COPPER MUST BE PLATED WITH ELECTROLESS NICKEL IMMERSION GOLD (ENIG) </li>
      <li> SILKCREEN LEGEND MUST BE APPLIED OVER SOLDERMASK ON TOP AND BOTTOM. SILKSCREEN SHALL BE WHITE IN COLOR. </li>
      <li> THERMAL VIAS UNDER COMPONENTS U2, U19, U22, U23, & U28 MUST BE NON-CONDUCTIVE EPOXY FILLED. </li>
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      <h4> Assembly Notes </h4>
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      <li> WORKMANSHIP TO BE EQUAL TO AND COMPLIANT WITH THE REQUIREMENTS OF IPC-A-610 CLASS II </li>
      <li> DEBURR EDGES AFTER DEPANELIZATION. </li>
      <li> APPLY URETHANE CONFORMAL COAT EXCEPT WHERE MASKED BY TOP / BOTTOM CONFORMAL COAT MASK GERBERS. </li>
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