Solder pad MOS.U.2-6 is a heat sponge 🧽

[somethingelseentirely]

MOS.U.2-6 is directly connected to 3 full copper layers, which makes it an insanely good heat sponge when soldering.

I mean, a lot of ground is great, but 3 layers? That's not ground, that's a heat sink. 🤣

[TheWerle]

The board would benefit greatly from solder-relief on all GND connections, both from the perspective of assembly on Ploopy's end or for utility to end-users. Grounding all the GPIO to a polygon takes away a ton of potential for kit-bashing for stuff like hand wiring mouse button inputs or integrating a Nano ball into keyboard enclosures Charybdis-style

If you route even a handful of the direct-connected GPIO to test-points then cuttable traces to GND you could achieve the same ESD / floating input protection with far greater utility. You've open-sourced these badboys, let people cook!