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Added ISL3295ExHZ-T and ISL3298ExRTZ-T to Interface_UART.lib #2922

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merged 20 commits into from
Aug 23, 2020
Merged

Added ISL3295ExHZ-T and ISL3298ExRTZ-T to Interface_UART.lib #2922

merged 20 commits into from
Aug 23, 2020

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UsairemAlamgeer
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@UsairemAlamgeer UsairemAlamgeer commented Aug 20, 2020

Added ISL3295ExHZ-T and ISL3298ExRTZ-T to Interface_UART.lib

[Outdated Replaced]
image

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All contributions to the kicad library must follow the KiCad library convention

Thanks for creating a pull request to contribute to the KiCad libraries! To speed up integration of your PR, please check the following items:

  • Provide a URL to a datasheet for the symbol(s) you are contributing
  • Provide a screenshot of the symbol(s) from the symbol editor with the pin types visible
  • Ensure that the associated footprints match the official footprint library
    • A new fitting footprint must be submitted if the library does not yet contain one.
  • If there are matching footprint PRs, provide link(s) as appropriate
  • Check the output of the Travis automated check scripts - fix any errors as required
  • Give a reason behind any intentional library convention rule violation.

Be patient, we maintainers are volunteers with limited time and need to check your contribution against the datasheet. You can speed up the process by providing all the necessary information (see above). And you can speed up the process even more by providing additional info like the screenshot of the symbol editor pin table (or for high pin counts converted to csv) sorted in the same way as the pin table in the datasheet and a direct link to the datasheet page that contains the pin table.

@aris-kimi
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aris-kimi commented Aug 20, 2020

Hi @UsairemAlamgeer , some tips:

Datasheet needs to be from a manufacturer and not distributors, links from distributors are accepted only if manufacturer does not provide one.

Description should be something like RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, SOT-23

Keywords should be something like RS485 RS422 transceiver Class 3 ESD Level

Package should be Package_TO_SOT_SMD:SOT-23-6

Footprint filter should be SOT?23*

Same logic should be applied to both symbols but with appropriate fields naming accordingly for TDFN package.

I am not so sure for the existing (SOT-23) package though, some dimensions do not seem to fit with values mentioned in the datasheet. My lib might needs an update, but to be sure you better wait for a full review from an experienced librarian.

@UsairemAlamgeer
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UsairemAlamgeer commented Aug 20, 2020

Thanks for the feedback @aris-kimi.

I will update just like you have pointed.
Also for the packages, I have designed a new SOT23 as per the Dimensions of the datasheet.

[Out of Date Screenshots Removed]

@aris-kimi
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There are still some things that need to change, for example, 3298 part needs to change in order to allow interchangeability between those two. DE, DI, Y and Z could be at the same place on both symbols. Also two GND pins have to be stacked.

I do not quite understand what those links mentioned here are about..

I could suggest to spend some time reading this: https://kicad-pcb.org/libraries/klc/ there is a lot of useful info.

@aris-kimi aris-kimi added Addition Adds new symbols to library Pending changes User is expected to perform fixes before merging labels Aug 21, 2020
@aris-kimi aris-kimi self-assigned this Aug 21, 2020
@UsairemAlamgeer
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@aris-kimi can you please let me know the changes you require.

Thanks

@aris-kimi
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As a general rule, when you create a PR, in the first comment, edit only the first line (as it is stated by its content) , use the task list provided to indicate PR's state.
Try not to upload a new image in every new comment and also not to quote every full comment somebody does.
Long scrolling PR's are not easy for any reviewer.
Try to create a complete first comment and update important parts there.

Spend some time to check other PRs, opened and closed to get an idea of how processes flow.

I haven't started a full review yet but i had some previous comments which you should consider.
When i start this review i will post a complete comment asking for changes. But please pay attention to the content of the sentences in github, since it is easy to miss things and mess things up.

These are some notes for now. I will get back to it when its time comes.

In the meantime you can try to fix travis violation S5.1 and S5.2.

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Question @cpresser ,
Datasheet:
εικόνα
Current SOT-23-6:
εικόνα
εικόνα
This requires a new SOT-23-6 i think but i am not sure for a prefix proposal. What should the name be? I need help with this.

My comments are presented below @UsairemAlamgeer :

Both symbols:

  • Body outline width must be 0.254mm as KLC states S3.3.1

  • Reference and value should be placed top left and to right accordingly.
    εικόνα

For first part ISL3295E:
- [ ] Name should change from ISL3295ExHZ-T to ISL3295E

  • Name should change from ISL3295E to ISL3295xxH

  • Description should change to RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, SOT-23

  • Keyword field should change to RS485 RS422 transceiver

For second part ISL3298E:
- [ ] Name should change from ISL3298ExRTZ-T to ISL3298E

  • Name should change from ISL3298E to ISL3298xxRT

  • VL is a power input pin type and has to be placed at the left side next to VCC.

  • Description should change to RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, TDFN-8

  • Keyword field should change to RS485 RS422 transceiver

  • One more pin should be added stacked with GND pins to connect to EP

- [ ] Footprint should be Package_DFN_QFN:TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias

  • Footprint should be TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm

- [ ] Footprint filter should be TDFN*1EP*3x2mm*P0.5mm*EP1.80x1.65mm*

  • Footprint filter should be TDFN*1EP*3x2mm*P0.5mm*

There will be some future additional comments for this review. But those are the most basic issues i found.

@cpresser
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Hi @aris-kimi, you are right, this is odd.

My conclusion is:

  1. For this symbol-PR keeping SOT-23-6 is fine. The manufacturer says it conforms to JEDEC. So no manufacturer variant is needed.
  2. We should replace the existing footprint with a generated one soon.

One other thing: The footprint should not contain the pin-count (KLC S5.3 Point 3). So TDFN*1EP*3x2mm*P0.5mm*EP1.80x1.65mm* is probably a better filter.

If you are unsure about footprint-filters, search the repo for similar parts. My search returned this:
image
(The command to produce that output was rg TDFN in the symbols folder)

@chschlue
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I mostly agree with what has already been said

  • the package matches MO-178, so FP SOT-23-5 for this symbol is correct, but our current FP is broken (or at least is based on some arbitrary recommendation, also its body dimensions are wrong (should be 1.6mm x 2.9mm))

but

ISL3295E
Symbol Name Changed
Symbol Description Changed
Symbol Keyword Changed

ISL3298E
Symbol Name Changed
Symbol Pin Position Changed
Symbol Description Changed
Symbol Keyword Changed
Symbol Footprint Changed
@aris-kimi
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Hi @chschlue , thank you for your input. This naming conclusion was based on these DS screenshots plus recent info about wildcard naming:
εικόνα
εικόνα

@UsairemAlamgeer
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UsairemAlamgeer commented Aug 22, 2020

Both symbols:

  • Body outline width must be 0.254mm as KLC states S3.3.1
  • Reference and value should be placed top left and to right accordingly.

For first part ISL3295E:

  • Name should change from ISL3295ExHZ-T to ISL3295E
  • Description should change to RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, SOT-23
  • Keyword field should change to RS485 RS422 transceiver

For second part ISL3298E:

  • Name should change from ISL3298ExRTZ-T to ISL3298E
  • VL is a power input pin type and has to be placed at the left side next to VCC.
  • Description should change to RS485, RS422, 20Mbps Transceiver, 3.0V to 7V, Low-Power, TDFN-8
  • Keyword field should change to RS485 RS422 transceiver
  • One more pin should be added stacked with GND pins to connect to EP
  • Footprint should be Package_DFN_QFN:TDFN-8-1EP_3x2mm_P0.5mm_EP1.80x1.65mm_ThermalVias
  • Footprint filter should be TDFN*1EP*3x2mm*P0.5mm*EP1.80x1.65mm*

@chschlue
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@aris-kimi wildcarding E is arguable. On one hand, the DS says it belongs to the actual part name. On the other hand, the nomenclature says it's ESD rating, which is non-functional.
But we definitely cannot leave out the package suffixes.

@aris-kimi
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Also about fp filter i considered this part:
εικόνα
If still needs a change, should that be without 1.80x1.65mm or without EP1.80x1.65mm ?

Of course i do not mean to argue, just to collect info.. Thank you. :)

@chschlue
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Without _EP1.80x1.65mm. See https://kicad-pcb.org/libraries/klc/S5.2/.

Sadly, not all symbols we currently have are correct and so are bad examples.

@aris-kimi
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@chschlue ,will that be a possible issue for a fix?

@UsairemAlamgeer please se my review's comments updated. Some changes i suggested weren't optimal so they need to change again.

@UsairemAlamgeer
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Sure @aris-kimi

@chschlue
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@aris-kimi sure

@chschlue
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One more thing I missed before: Default FP should not include thermal vias.

@aris-kimi
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Comments updated. @UsairemAlamgeer infrom me when you have applied all changes asked for a final review.

@UsairemAlamgeer
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Changes have been made @aris-kimi

F2 "Package_TO_SOT_SMD:SOT-23-6" 0 650 50 H I C CNN
F3 "" 0 650 50 H I C CNN
DEF ISL3295xxH U? 0 20 Y Y 1 F N
F0 "U?" -200 450 50 H V C CNN
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Please remove ? after U

@aris-kimi
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Hi @UsairemAlamgeer , thank you for appling all changes asked.

@chschlue i think i am ok now. All my comments have applied. Do you think there is something i forgot?
I will merge this in the next few minutes.

@chschlue
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LGTM

@aris-kimi aris-kimi merged commit 35beb60 into KiCad:master Aug 23, 2020
@antoniovazquezblanco antoniovazquezblanco removed the Pending changes User is expected to perform fixes before merging label Aug 25, 2020
@antoniovazquezblanco antoniovazquezblanco added this to the 5.1.7 milestone Aug 25, 2020
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